Measurement System for Alignment Layer Film

Features of Measurement System for Alignment Layer Film Standalone Type

Main Applications

Specifications

Light Source Semiconductor excitation laser (Class 3B)
Light Receiving Element Photoelectric multiplier tube
Beam Diameter φ 30 μm approx.
Measurement Modes High-speed mode (SMP method), analysis mode (GE method)
Measurement Resolution Orientation direction : 0.1°
Tilt angle parameter: 0.2°
Film thickness: 0.1 nm Refractive index: 0.001
Film Thickness Measurement Range 1 nm to 1 μm (Varies by sample type.)
Sample Size Up to 300 x 300 mm

Measurement Items

Measurement Modes Measurement Items
Orientation Direction  Anisotropy Tilt Angle Refractive Index Film Thickness
High-speed Mode (SMP Method)
(relative values)

(relative values)
- -
Analysis Mode (GE Method) -

Measurement Examples

Example 1: Rubbing Depth Relative to Magnitude of Anisotropy

Using the SMP method to measure the alignment layer film is a highly effective way to control rubbing processes. The graph below shows the change in the anisotropy (vertical axis) as the rubbing depth (horizontal axis) increases.

The rubbing intensity can be rigorously controlled by setting a threshold value for the anisotropy.

Example 2: Mapping measurement

Enables measurement of several points on a grid superimposed on the sample. Mapping measurement requires only very simple settings, and can be used to easily display orientation distribution, rubi-suji (rubbing streaks and other alignment layer film features not visible with conventional methods.

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