IR-MEMS Inspector

Features and Specifications

  • A single unit can handle various inspections and tests from low-magnification macro defect detection to high-magnification micro-analysis.
  • Lighting/optics technologies and various image preprocessing techniques enable high-contrast images.
  • High-precision image synthesizing technology lets you evaluate wafers up to 200 mm in diameter in a single operation.
  • All stage and lighting operations are controlled from a PC.

Main Applications

  • MEMS wafer packaging development and inspection
  • Void detection in bonded Si wafers for MEMS packaging
  • Inspcetion of FOWLP*1 WLCSP*2 wafers
  • Inspection of tipping in dicing edge of wafers
  • Peeling inspection after low-k film grooving
  • Side-etching inspection in the sacrificing oxide layer
  • Wafer inspection of SOI*3 SOS*4 SiC*5 GaN*6
  • Non-destructive inspection of the anodically bonded interface

*1 Fan Out Wafer-Level-Packaging
*2 Wafer Level Chip Scale Package
*3 Silicon on Insulator
*4 Silicon on Sapphire
*5 Silicon Carbide
*6 Gallium Nitride


Maximum Wafer Diameter200mm (8 inch)
Optical SystemPC controlled, Motor zoom lenses
MagnificationLow-mag. Lens0.75x to 4.5x
High-mag. Lens7x to 40x
Field of View FOVLow-mag. Lens7.51 x 9.39mm 1.25 x 1.56mm
High-mag. Lens0.80 x 1.01mm~0.14 x 0.18mm
IlluminationHigh- & Low-mag.Near-infrared coaxial & transmission types
OptionVisible ring illumination
Mechanical SystemMotor Driven Stage
Stroke LengthX-Stage200mm
OptionWafer jig unit (for 4-, 6-, 8-inch wafer)
ControlPC ControlChange magnification, Exchange High- & Low-mag lenses, Illumination control, Stage control
SoftwareImage processing, Image stitching (up to 8-inch full wafer image),
Simple Measurement: 2-point, circle area and rectangle area, etc.

The Real Power of the Twin IR Zoom Lenses! (0.75x to 40x)

Operating principle

Transmission Principle

Since silicon has a characteristic band gap energy of 1.1 eV, it is permeated by light wavelengths of around 1,100 nm, making it appear as transparent as glass.

MORITEX provides complete solutions optimized by abundant expertise of design and manufacturing of lighting and lens devices accumulated over many years.


Post-dicing backside chipping

Bonding failure or voids in bond interiors

Comparison of bonding seen under infrared and special illumination